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3G Module
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CWM630

CWM630 is a HSDPA module with a stamp hole patch package. It uses Qualcomm's latest WCDMA single-chip platform QSC6270 supports embedded operating systems such as WinCE/Linux and has functions such as voice SMS and high-speed data services.

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+86 021-50177336

     Manual Download
      CWM630 HSDPA Stamp Hole Module Hardware User Guide
      YUGA_CWM630_AT

     Driver Download
      3G Windows driver

           

    CWM600
    CWM900
    CEM600
    CEM630
    CWM600
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